Title :
Effects of IMC thickness on fracturing of solder joints
Author :
Wang Chunke ; Qin Fei ; An Tong
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
Abstract :
Cracking along the intermetallic compound (IMC) interface in solder joints is the most important failure mechanism in electronics packages. In order to understand the failure mechanism well, a 2D solder/IMC interface model is used to examine the stress around the interface. Three solder materials, Sn37Pb, Sn3.5Ag and Sn3.0Ag0.5Cu, and various IMC thicknesses, which represent different growth stages of the IMC, are considered to investigate their effects on the interfacial stress. The stress intensity factor, H, which is used as bi-material interface failure criterion, are calculated for various IMC thicknesses.
Keywords :
copper alloys; cracks; electronics packaging; fracture; lead alloys; silver alloys; solders; tin alloys; 2D solder-IMC interface model; SnAgCu; SnPb; cracking; electronics packages; fracture; interfacial stress; intermetallic compound thickness; solder joints; stress intensity factor; Electronics packaging; Joints; Lead; Materials; Reliability; Soldering; Stress;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582395
