DocumentCode
2273888
Title
Design of a front-end of a Ku-band transceiver based on LTCC technology
Author
Hanzhang, Su ; Mengjiang, Xing ; Yuejin, Li ; Wei, Li
Author_Institution
Sch. of Microelectron., Xidian Univ., Xi´´an, China
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
851
Lastpage
855
Abstract
In this paper, we present design, analysis and simulation of a front-end of a transceiver which works in Ku-band (15.5 GHz) based on multi-layer LTCC (low temperature co-fire ceramic) technology. The superheterodyne structure is selected and some GaAs bare chips from Hittite company such as mixer, power amplifier, LNA, drive amplifier are used in this MCM (multi-chip module). Some considerations about the system design are considered first, by the simulation of the system we can got the following results: NF<;3.5 dB, Gain.26 dB, Sensitivity about -80 dBm. Most of the passive devices including filters, power dividers, transmission lines, impedance matching network are integrated in the LTCC substrate. The active devices are mounted on the surface of LTCC substrate. The entire module is achieved with 15-layer LTCC substrate and the area is about 50 mm*30 mm.
Keywords
ceramics; gallium arsenide; low noise amplifiers; power amplifiers; transceivers; GaAs bare chip; Ku-band transceiver; LNA; drive amplifier; filter; frequency 15.5 GHz; impedance matching network; low temperature co-fire ceramic technology; mixer; multichip module; multilayer LTCC; passive devices; power amplifier; power divider; superheterodyne structure; transmission lines; Microstrip; Microwave filters; Power transmission lines; Resonator filters; Scattering parameters; Substrates; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582409
Filename
5582409
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