Preparation and characterization of ultrasonic electrodeposited copper coating

Author

Cui, Ronghong ; He, Yuting ; Yu, Zhiming ; Shu, Wenjun ; Du, Jinqiang

Author_Institution

Eng. Coll., Air Force Eng. Univ., Xi´´an, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

847

Lastpage

850

Abstract

Copper has replaced aluminum as the main interconnect material in VLSI, due to its low resistivity and high electromigration resistance. The property of copper coating is a key factor that determines the reliability of interconnects. A special copper coating was prepared by ultrasonic-electrodeposition method in this study, and the microstructure, hardness, wear resistance, adhesion and corrosion resistance of it were investigated respectively. Test results show that the crystallite size of it is obviously smaller than that of the ordinary electrodeposited copper coating, and the hardness, wear resistance, adhesion and corrosion resistance of it are all evidently enhanced.

Keywords

VLSI; copper; electrodeposition; integrated circuit interconnections; integrated circuit reliability; ultrasonic applications; Cu; VLSI interconnect material; adhesion resistance; corrosion resistance; high electromigration resistance; interconnect reliability; ultrasonic electrodeposited copper coating method; wear resistance; Acoustics; Adhesives; Coatings; Copper; Corrosion; Resistance; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582413

Filename

5582413