• DocumentCode
    2274019
  • Title

    Optimization of broadband characterization for pluggable parallel optical transceiver modules on multilayer substrates

  • Author

    Li, Baoxia ; Gao, Wei ; Liu, Fengman ; Xiang, Haifei ; Zhou, Jing ; Li, Jun ; Li, Zhihua ; Song, Jian ; Wan, Lixi

  • Author_Institution
    Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    834
  • Lastpage
    838
  • Abstract
    In this paper, we discuss the optimization of the high frequency performance of a parallel optical transceiver module, which is electrically pluggable, and its test board. A 6-layer printed circuit board (PCB) with embedded high-dielectric constant (Dk) material was built as a substrate for the optical transceiver module. An analysis of the signal integrity (SI) and power integrity (PI) is carried out. The RF signal quality of the differential transmission lines is demonstrated by 3-D electromagnetic simulations and 4-port Network Analyzer measurements in terms of the transmission parameter S21, the reflection parameter S11, and the time-domain reflection TDR. A 4-layer test board with 16 edge-mounted SMA connectors and one 38-pin sliding connector for optical transceiver module was also constructed. Finally, Eye-diagrams of each of the 8 channels comprising the four-channel bidirectional active optical cable (AOC) are measured.
  • Keywords
    S-parameters; modules; network analysers; optical cables; optical interconnections; permittivity; printed circuits; transceivers; transmission lines; 3D electromagnetic simulations; 4-port network analyzer measurements; 6-layer printed circuit board; RF signal quality; S11 reflection parameter; S21 transmission parameter; broadband characterization optimisation; differential transmission lines; edge-mounted SMA connectors; embedded high-dielectric constant material; eye diagrams; four-channel bidirectional active optical cable; multilayer substrates; pluggable parallel optical transceiver modules; power integrity analysis; signal integrity analysis; sliding connector; test board; time-domain reflection TDR; Connectors; Fingers; Gold; High speed optical techniques; Optical fibers; Optical reflection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582415
  • Filename
    5582415