• DocumentCode
    2274094
  • Title

    Preparation of nano silver pastes applied in printed electronics

  • Author

    Chen, Xiangyan ; Sun, Mingfei ; Xiao, Fei

  • Author_Institution
    Dept. of Mater. Sci., Fudan Univ., Shanghai, China
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    279
  • Lastpage
    282
  • Abstract
    Printed electronics have become research focus due to their distinct characteristics such as tiny, flexible, thin, and easy to carry. Printed electronics have shown great potential in daily use, such as RFID tags, smart cards and displays. Silver nanoparticles have been applied as conductors in printed electronics. Different kinds of chemicals are used as solvent and stabilizers to prepare nano silver pastes in the paper. Silver nanoparticles are well distributed in the chemicals by ultrasonic method. The nano silver pastes are deposited on glass slides. Nano silver pastes are annealed at certain temperature to thermally decompose the stabilizers and solvent. The resultant nano silver films are sintered and highly conductive. The resistivity of conductive silver films prepared by using lactic acid and ethylene glycol was 2.6 × 10-5 Ω·cm after annealing at 200°C for 30 min, and the resistivity was 6.4 × 10-6 Ω·cm when the silver conductive films was annealed at 250°C. The microstructures of conductive lines formed by this method are investigated by SEM and SPM.
  • Keywords
    annealing; nanoelectronics; nanoparticles; printed circuits; scanning electron microscopy; scanning probe microscopy; silver; Ag; RFID tags; SEM; SPM; conductive line microstructures; conductive silver film resistivity; conductors; ethylene glycol; glass slides; lactic acid; nanosilver paste preparation; printed electronics; silver nanoparticles; smart cards; temperature 200 degC; temperature 250 degC; time 30 min; ultrasonic method; Annealing; Conductive films; Conductivity; Ink; Nanoparticles; Silver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582419
  • Filename
    5582419