• DocumentCode
    2274263
  • Title

    Adaptive Echo State Network to maximize overhead power line dynamic thermal rating

  • Author

    Yang, Yi ; Harley, Ronald ; Divan, Deepak ; Habetler, Thomas

  • Author_Institution
    Georgia Tech, Atlanta, GA, USA
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    2247
  • Lastpage
    2254
  • Abstract
    A widely distributed power line sensor network (PLSN) has been proposed to monitor such a utility asset´s status. One of its important applications is to evaluate the real time dynamic current capacity of overhead power lines down to `per span´ level of granularity, and thus to maximize the existing power grid utilization. How to predict the conductor temperature ahead of time subject to various conductor overload conditions is the most critical and challenging task to evaluate the line dynamic thermal rating. This paper proposes an Echo State Network (ESN) to adaptively identify the nonlinear overhead conductor thermal dynamics under different weather conditions, and to predict the conductor temperature. This method requires only temperatures and line current as inputs and its simplified calculation makes it an attractive and cost effective solution to real-time implementation. Furthermore, by continuously providing accurate real-time line thermal conditions, this method can assist in utilizing the power lines more effectively.
  • Keywords
    power grids; power overhead lines; thermal analysis; wireless sensor networks; adaptive echo state network; conductor temperature; distributed power line sensor network; line current; nonlinear overhead conductor thermal dynamics; overhead power line dynamic thermal rating; power grid utilization; real time dynamic current capacity; Echo State Network; Smart grid; artificial intelligence; distributed monitoring; dynamic thermal rating; power line; sensor network;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2893-9
  • Electronic_ISBN
    978-1-4244-2893-9
  • Type

    conf

  • DOI
    10.1109/ECCE.2009.5316095
  • Filename
    5316095