DocumentCode
2274296
Title
PLAD (Plasma Doping) on 22nm Technology Node and Beyond - Evolutionary and/or Revolutionary
Author
Qin, Shu ; Hu, Y. Jeff ; McTeer, Allen
Author_Institution
Micron Technol. Inc., Boise, ID, USA
fYear
2012
fDate
14-15 May 2012
Firstpage
1
Lastpage
11
Abstract
PLAD (plasma doping) is promising for both evolutionary and revolutionary doping options because of its unique advantages which can overcome or minimize many of the issues of the beam-line (BL) based implants. In this talk, we present developments of PLAD on both planar and 3D device structures. Comparing with the conventional BL implants, PLAD shows not only a significant production enhancement, but also a significant device performance improvement and 3D structure doping capability, including an 80% contact resistance reduction, more than 25% drive current increase, and conformal doping on non-planar device structures. In PLAD developments and applications, the conventional metrologies are not suitable for PLAD process because of their limits and PLAD´s unique properties. Novel diagnostic metrologies for PLAD process have been developed and are also presented in this talk.
Keywords
contact resistance; elemental semiconductors; nanoelectronics; plasma materials processing; semiconductor doping; silicon; 22nm technology node; 3D device structure; 3D structure doping capability; PLAD; PLAD process; beam-line based implant; conformal doping; contact resistance reduction; nonplanar device structure; novel diagnostic metrology; planar device structure; plasma doping; Contact resistance; Doping; Implants; Junctions; Plasmas; Silicon; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology (IWJT), 2012 12th International Workshop on
Conference_Location
Shanghai
Print_ISBN
978-1-4673-1258-5
Electronic_ISBN
978-1-4673-1256-1
Type
conf
DOI
10.1109/IWJT.2012.6212800
Filename
6212800
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