DocumentCode :
2274296
Title :
PLAD (Plasma Doping) on 22nm Technology Node and Beyond - Evolutionary and/or Revolutionary
Author :
Qin, Shu ; Hu, Y. Jeff ; McTeer, Allen
Author_Institution :
Micron Technol. Inc., Boise, ID, USA
fYear :
2012
fDate :
14-15 May 2012
Firstpage :
1
Lastpage :
11
Abstract :
PLAD (plasma doping) is promising for both evolutionary and revolutionary doping options because of its unique advantages which can overcome or minimize many of the issues of the beam-line (BL) based implants. In this talk, we present developments of PLAD on both planar and 3D device structures. Comparing with the conventional BL implants, PLAD shows not only a significant production enhancement, but also a significant device performance improvement and 3D structure doping capability, including an 80% contact resistance reduction, more than 25% drive current increase, and conformal doping on non-planar device structures. In PLAD developments and applications, the conventional metrologies are not suitable for PLAD process because of their limits and PLAD´s unique properties. Novel diagnostic metrologies for PLAD process have been developed and are also presented in this talk.
Keywords :
contact resistance; elemental semiconductors; nanoelectronics; plasma materials processing; semiconductor doping; silicon; 22nm technology node; 3D device structure; 3D structure doping capability; PLAD; PLAD process; beam-line based implant; conformal doping; contact resistance reduction; nonplanar device structure; novel diagnostic metrology; planar device structure; plasma doping; Contact resistance; Doping; Implants; Junctions; Plasmas; Silicon; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology (IWJT), 2012 12th International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4673-1258-5
Electronic_ISBN :
978-1-4673-1256-1
Type :
conf
DOI :
10.1109/IWJT.2012.6212800
Filename :
6212800
Link To Document :
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