Microprobe metrology for direct sheet resistance and mobility characterization

Author

Nielsen, Peter Folmer ; Petersen, Dirch H. ; Lin, Rong ; Jensen, Ane ; Henrichsen, Henrik H. ; Gammelgaard, Lauge ; Kjær, Daniel ; Hansen, Ole

Author_Institution

CAPRES A/S, Scion-DTU, Lyngby, Denmark

fYear

2012

fDate

14-15 May 2012

Firstpage

100

Lastpage

105

Abstract

The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads. Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers. Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance, mobility and active carrier density measurements using the collinear M4PP. In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.

Keywords

electric resistance measurement; M4PP measurement technique; active carrier density measurement; automatic microRSP probing tool; direct sheet resistance measurement; in-line sheet resistance measurement; microprobe metrology; mobility characterization; patterned wafers; semiconductor industry; small structures/pads; ultra thin layers; Accuracy; Loading; Probes;

fLanguage

English

Publisher

ieee

Conference_Titel

Junction Technology (IWJT), 2012 12th International Workshop on

Conference_Location

Shanghai

Print_ISBN

978-1-4673-1258-5

Electronic_ISBN

978-1-4673-1256-1

Type

conf

DOI

10.1109/IWJT.2012.6212819

Filename

6212819