DocumentCode
227496
Title
The investigation of interaction between low-temperature solders and emission body of dispenser cathodes
Author
Dyubua, B.C. ; Polivnikova, O.V.
Author_Institution
Cathode Dept., JSC Research & Production Corp. “ISTOK” named after A.I. Shokin, Fryazino, Russia
fYear
2014
fDate
June 30 2014-July 4 2014
Firstpage
1
Lastpage
2
Abstract
The principal problem, which arises at construction of multibeam cathode units, is provision of small spread in emission parameters of separate emitters in the unit preserving the mechanical strength and the shape stability of the cathode unit. The problem is reduced to task of effective attachment of emitters to their seats in the holder of the unit.
Keywords
cathodes; emission; low-temperature techniques; mechanical strength; solders; dispenser cathodes; emission body interaction; emitter effective attachment; low-temperature solders interaction; mechanical strength; multibeam cathode unit construction; principal problem; shape stability; unit holder; Cathodes; Compounds; Materials; Soldering; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electron Sources Conference (IVESC), 2014 Tenth International
Conference_Location
St. Petersburg
Print_ISBN
978-1-4799-5770-5
Type
conf
DOI
10.1109/IVESC.2014.6892087
Filename
6892087
Link To Document