Title :
Table of contents
Abstract :
The following topics are dealt with: yield enhancement; factory optimization; defect inspection; advanced metrology; advance process control equipment and materials productivity; advanced patterning; design for manufacturability, and; through silicon via.
Keywords :
design for manufacture; inspection; integrated circuit interconnections; integrated circuit measurement; integrated circuit yield; process control; advance process control equipment; advanced metrology; advanced patterning; defect inspection; design for manufacturability; factory optimization; materials productivity; through silicon via; yield enhancement;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location :
Saratoga Springs, NY
Print_ISBN :
978-1-4673-0350-7
DOI :
10.1109/ASMC.2012.6212857