DocumentCode
2275800
Title
Managing variability within wafertest production by combining lean and six sigma
Author
Eberts, Dietrich ; Rottnick, Ralph ; Schneider, Germar ; Keil, Sophia ; Lasch, Rainer ; Buhmann, Oliver
Author_Institution
Depts. of Line Control, Wafertest & Quality Manage., Infineon Technol. Dresden GmbH, Dresden, Germany
fYear
2012
fDate
15-17 May 2012
Firstpage
33
Lastpage
38
Abstract
Manufacturing organization in the manner of flow production is one of the best solutions to achieve short cycle times, low inventories and a high delivery reliability, which are vital for commercial success. Variability within all production, support and organizational processes is one of the main detractors for establishing a continuous material flow in semiconductor manufacturing. In this contribution an approach for identification, classification, observation, reduction, mastering and even elimination of variability is shown. This is done by combining elements as well as tools of lean manufacturing and six sigma. The approach is validated by a case study in a wafertest environment and enables establishing the Virtual Time based Flow Principle.
Keywords
lean production; semiconductor industry; six sigma (quality); continuous material flow; high delivery reliability; lean production; semiconductor manufacturing; six sigma; virtual time based flow principle; wafertest production; Delay effects; Logic gates; Manufacturing; Materials; Organizations; Production; Six sigma; Wafertest; continuous flow manufacturing; mastering variability; semiconductor industry; six sigma; value stram design;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-4673-0350-7
Type
conf
DOI
10.1109/ASMC.2012.6212864
Filename
6212864
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