• DocumentCode
    2275800
  • Title

    Managing variability within wafertest production by combining lean and six sigma

  • Author

    Eberts, Dietrich ; Rottnick, Ralph ; Schneider, Germar ; Keil, Sophia ; Lasch, Rainer ; Buhmann, Oliver

  • Author_Institution
    Depts. of Line Control, Wafertest & Quality Manage., Infineon Technol. Dresden GmbH, Dresden, Germany
  • fYear
    2012
  • fDate
    15-17 May 2012
  • Firstpage
    33
  • Lastpage
    38
  • Abstract
    Manufacturing organization in the manner of flow production is one of the best solutions to achieve short cycle times, low inventories and a high delivery reliability, which are vital for commercial success. Variability within all production, support and organizational processes is one of the main detractors for establishing a continuous material flow in semiconductor manufacturing. In this contribution an approach for identification, classification, observation, reduction, mastering and even elimination of variability is shown. This is done by combining elements as well as tools of lean manufacturing and six sigma. The approach is validated by a case study in a wafertest environment and enables establishing the Virtual Time based Flow Principle.
  • Keywords
    lean production; semiconductor industry; six sigma (quality); continuous material flow; high delivery reliability; lean production; semiconductor manufacturing; six sigma; virtual time based flow principle; wafertest production; Delay effects; Logic gates; Manufacturing; Materials; Organizations; Production; Six sigma; Wafertest; continuous flow manufacturing; mastering variability; semiconductor industry; six sigma; value stram design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4673-0350-7
  • Type

    conf

  • DOI
    10.1109/ASMC.2012.6212864
  • Filename
    6212864