Investigation and characterization of a high performance, small form factor, modular liquid immersion cooled server model

As the demand for power consumption increases with an expanding global economy, the need for innovative solutions to meet the cooling demands of next generation servers looms large. Particular attention must be paid to ensuring that cooling mechanisms employed are not only efficient from a power consumption perspective, but tightly packed to avoid needlessly expansive server rooms resulting in increased construction costs and energy waste from cooling superfluous spaces. With these concerns in mind, a small form factor, high input power solution is presented that involves no surface modifications, i.e. bare silicon die. In this 150 mm × 300 mm × 38 mm (H × L × W) space, two-phase heat transfer results in roughly 400 Watts rejected from the four-die arrangement and at a level well below the Critical Heat Flux.