DocumentCode :
227621
Title :
ELDO-COMSOL based 3D electro-thermal simulations of power semiconductor devices
Author :
De Falco, G. ; Riccio, M. ; Romano, Gianmarco ; Maresca, L. ; Irace, A. ; Breglio, G.
Author_Institution :
Dept. of Electr. Eng. & Inf. Technol., Univ. of Naples Federico II, Naples, Italy
fYear :
2014
fDate :
9-13 March 2014
Firstpage :
35
Lastpage :
40
Abstract :
In this work we present a novel simulation environment for analysis of electro-thermal interaction in power semiconductor devices. The developed solution is based on the joint use of ELDO-COMSOL simulators in an iterative scheme between an electrical 2D SPICE network and 3D FEM thermal solver. The power device is described with a multi-cellular approach using proper temperature dependent SPICE library and macro-cell concept. The thermal problem is solved on a 3D domain considering the full chip structure, including package and bond-wires. In order to validate the proposed approach, simulations during short-circuit tests have been performed considering a commercial STripFET II Power-MOSFET. Finally the simulation results have been compared with transient InfraRed (IR) thermal measurements proving the effectiveness of the new simulator.
Keywords :
finite element analysis; infrared imaging; iterative methods; lead bonding; power MOSFET; power semiconductor devices; semiconductor device models; 3D FEM thermal solver; ELDO-COMSOL based 3D electrothermal simulations; ELDO-COMSOL simulators; IR thermal measurements; STripFET II power MOSFET; bond wires; electrical 2D SPICE network; electrothermal interaction; iterative scheme; macrocell concept; multicellular approach; power semiconductor devices; short-circuit tests; temperature dependent SPICE library; transient infrared thermal measurements; Geometry; Integrated circuit modeling; SPICE; Solid modeling; Temperature dependence; Temperature measurement; Three-dimensional displays; Electro-thermal Simulation; Infrared-Thermography; Power-MOSFET; Short-Circuit Robustness; Thermal Runaway;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2014 30th Annual
Conference_Location :
San Jose, CA
Type :
conf
DOI :
10.1109/SEMI-THERM.2014.6892212
Filename :
6892212
Link To Document :
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