DocumentCode
2276296
Title
Minimum power loss control — thermoelectric technology in power electronics cooling
Author
Wang, Jin ; Zou, Ke ; Friend, Jeremiah
Author_Institution
205 Dreese Lab., Ohio State Univ., Columbus, OH, USA
fYear
2009
fDate
20-24 Sept. 2009
Firstpage
2543
Lastpage
2548
Abstract
This paper investigates the possibility of using thermoelectric cooling (TEC) modules to improve the power density of power electronics systems. A simple test setup served for comparison purposes is built. The result shows that, through the use of TEC modules to actively cool power electronics devices, the power handling capability is improved versus that of an identical passively cooled system. Then a minimum power loss control strategy for TEC is proposed. Experimental results are shown to demonstrate the effectiveness of the proposed control strategy.
Keywords
cooling; power electronics; thermoelectric devices; TEC modules; identical passively cooled system; minimum power loss control strategy; power electronics cooling system; power handling capability; thermoelectric cooling modules; Active Cooling; Minimum Power Loss; Power Electronics; TEC; Thermoelectric Cooling; Thermoelectric Technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2893-9
Electronic_ISBN
978-1-4244-2893-9
Type
conf
DOI
10.1109/ECCE.2009.5316185
Filename
5316185
Link To Document