• DocumentCode
    2276296
  • Title

    Minimum power loss control — thermoelectric technology in power electronics cooling

  • Author

    Wang, Jin ; Zou, Ke ; Friend, Jeremiah

  • Author_Institution
    205 Dreese Lab., Ohio State Univ., Columbus, OH, USA
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    2543
  • Lastpage
    2548
  • Abstract
    This paper investigates the possibility of using thermoelectric cooling (TEC) modules to improve the power density of power electronics systems. A simple test setup served for comparison purposes is built. The result shows that, through the use of TEC modules to actively cool power electronics devices, the power handling capability is improved versus that of an identical passively cooled system. Then a minimum power loss control strategy for TEC is proposed. Experimental results are shown to demonstrate the effectiveness of the proposed control strategy.
  • Keywords
    cooling; power electronics; thermoelectric devices; TEC modules; identical passively cooled system; minimum power loss control strategy; power electronics cooling system; power handling capability; thermoelectric cooling modules; Active Cooling; Minimum Power Loss; Power Electronics; TEC; Thermoelectric Cooling; Thermoelectric Technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2893-9
  • Electronic_ISBN
    978-1-4244-2893-9
  • Type

    conf

  • DOI
    10.1109/ECCE.2009.5316185
  • Filename
    5316185