DocumentCode :
2276296
Title :
Minimum power loss control — thermoelectric technology in power electronics cooling
Author :
Wang, Jin ; Zou, Ke ; Friend, Jeremiah
Author_Institution :
205 Dreese Lab., Ohio State Univ., Columbus, OH, USA
fYear :
2009
fDate :
20-24 Sept. 2009
Firstpage :
2543
Lastpage :
2548
Abstract :
This paper investigates the possibility of using thermoelectric cooling (TEC) modules to improve the power density of power electronics systems. A simple test setup served for comparison purposes is built. The result shows that, through the use of TEC modules to actively cool power electronics devices, the power handling capability is improved versus that of an identical passively cooled system. Then a minimum power loss control strategy for TEC is proposed. Experimental results are shown to demonstrate the effectiveness of the proposed control strategy.
Keywords :
cooling; power electronics; thermoelectric devices; TEC modules; identical passively cooled system; minimum power loss control strategy; power electronics cooling system; power handling capability; thermoelectric cooling modules; Active Cooling; Minimum Power Loss; Power Electronics; TEC; Thermoelectric Cooling; Thermoelectric Technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2893-9
Electronic_ISBN :
978-1-4244-2893-9
Type :
conf
DOI :
10.1109/ECCE.2009.5316185
Filename :
5316185
Link To Document :
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