DocumentCode
227654
Title
Thermal conditions for portable military electronic equipment
Author
Wilcoxon, R.
Author_Institution
Rockwell Collins, Cedar Rapids, IA, USA
fYear
2014
fDate
9-13 March 2014
Firstpage
133
Lastpage
138
Abstract
Soldiers and Marines rely on electronics for communication, navigation and situational awareness. Increasing these capabilities, such as with longer range and higher bandwidth communication, generally comes at a price of greater power consumption and a corresponding increase in system power dissipation/thermal load. This increased power dissipation can limit the functional capabilities of systems when used in thermally challenging environments. One of these thermally challenging environments is inside the packs used by dismounted troops. This paper presents the results of testing to quantify the thermal resistance associated with operating electronics within packs that are typical of those that may be used by soldiers and Marines. Thermal mock-up systems were tested in two types of backpacks under various conditions. Steady state and transient temperature test results are compared to predictions generated with a spreadsheet-based analysis.
Keywords
bags; electronic equipment testing; military equipment; power consumption; thermal management (packaging); thermal resistance; portable military electronic equipment; power consumption; spreadsheet-based analysis; steady state test; system power dissipation; thermal load; thermal mock-up systems; thermal resistance; transient temperature test; Fans; Heat transfer; Power dissipation; Testing; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2014 30th Annual
Conference_Location
San Jose, CA
Type
conf
DOI
10.1109/SEMI-THERM.2014.6892229
Filename
6892229
Link To Document