• DocumentCode
    2276622
  • Title

    Fabrication and modeling of a planar magnetic structure with directly etched windings

  • Author

    Prasai, Anish ; Odendaal, Willem G.

  • Author_Institution
    Intell. Power Infrastruct. Consortium (IPIC), Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    1895
  • Lastpage
    1902
  • Abstract
    Methodology for directly growing three-dimensional windings on a planar, insulated ferromagnetic core through the process of electroplating and etching is presented in this paper. Designs employing high frequency inductors and transformers built in such a fashion offer tight control over parasitics from sample to sample while achieving higher power density and lower profile compared to other popular planar structures. Further, such structures are believed to be suitable as fundamental building blocks for magnetics designs with standardized cores and pre-electroplated, standardized winding patterns. They can be surface mounted on a PCB and configured by the end-user to meet his or her design specifications. To facilitate rapid design evaluation and achieve shorter design cycles, reduced-order analytical modeling based on Schwarz-Christoffel mapping and method of images for estimating parasitics of the structure is presented. The results of the models are compared against finite element modeling and experimental measurements, and are found to be acceptably accurate.
  • Keywords
    electroplating; etching; ferromagnetic materials; 3D windings; Schwarz-Christoffel mapping; electroplating; etched windings; etching; finite element modeling; high frequency inductors; high frequency transformers; higher power density; insulated ferromagnetic core; planar magnetic structure; reduced-order analytical modeling; standardized winding pattern; 3D etching; electroplating; foil winding; method of images; planar magnetics; vapor deposition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2893-9
  • Electronic_ISBN
    978-1-4244-2893-9
  • Type

    conf

  • DOI
    10.1109/ECCE.2009.5316202
  • Filename
    5316202