Impact of data center cooling strategies on component reliability

Author

Daniel, Andy ; Ahuja, Narendra

fYear

2014

fDate

9-13 March 2014

Firstpage

197

Lastpage

201

Abstract

In a data center environment, the temperature that a chip experiences is an important parameter determining its reliability. A high operating temperature can cause it to wearout prematurely. A low temperature results in additional cooling costs to operate the data center. In typical data center operation, there arises a distribution of component temperatures that are sensitive to the specific cooling strategies being used. This paper evaluates the impact of various data center cooling strategies on component reliability focusing on the gate oxide time dependent dielectric breakdown (TDDB) mechanism on a 32nm chipset component.

Keywords

air conditioning; computer centres; electric breakdown; thermal management (packaging); TDDB mechanism; chipset component; component reliability; data center cooling strategies; data center environment; data center operation; gate oxide; high operating temperature; size 32 nm; time dependent dielectric breakdown mechanism; Cooling; Integrated circuit reliability; Logic gates; Market research; Temperature distribution; Temperature sensors; Air Conditioning Unit; Air Handling Unit; Component reliability; Computer room air conditioner; gate oxide (TDDB) mechanism;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2014 30th Annual

Conference_Location

San Jose, CA

Type

conf

DOI

10.1109/SEMI-THERM.2014.6892239

Filename

6892239