Title :
Humidity rise after purge in micro-environments
Author :
Moon, Sung In ; Extrand, C.W.
Author_Institution :
Entegris, Inc., Chaska, MN, USA
Abstract :
The mass transport properties of four micro-environment (ME) materials were tested: polycarbonate (PC), poly(ether imide) (PEI), poly(ether ether ketone) (PEEK) and the Entegris barrier material (EBM). Permeation, diffusion and solubility coefficients of water vapor were measured at room temperature with 45% and 100% relative humidity (RH). These mass transport coefficients were used to estimate the humidity rise after purge in a 300 mm front opening unified pod (FOUP) constructed of these materials. PC was estimated to show 20% humidity rise two hours after purge. PEI was comparable to PC. PEEK showed better performance than PC or PEI. EBM showed the best water permeation resistance and the slowest and lowest humidity rise.
Keywords :
humidity; polymers; semiconductor technology; solubility; Entegris barrier material; diffusion coefficient; front opening unified pod; humidity rise; mass transport property; microenvironment; permeation coefficient; polycarbonate; polyether ether ketone; polyether imide; relative humidity; semiconductor manufacturing technology; size 300 mm; solubility coefficient; water permeation resistance; water vapor; Films; Humidity; Permeability; Plastics; Standards; Temperature measurement; humidity; materials; micro-environment; permeation;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location :
Saratoga Springs, NY
Print_ISBN :
978-1-4673-0350-7
DOI :
10.1109/ASMC.2012.6212917
