Lithography challenges and solutions for MEMS/LED/ABS applications

Similar to IC manufacturing, Cost of Ownership (CoO) and enhanced productivity are key focus areas for Microelectromechanical Systems (MEMS), Light Emitting Diodes (LED) and Air Bearing Surface (ABS) manufacturers. Here also, cost reduction can be achieved by incorporating more devices on a single wafer, increasing the wafer size, through yield improvements, as well as by reducing maintenance and operating costs. The lithography tools must provide sufficient resolution to satisfy imaging requirements, but it is imperative that they also deliver large depth of focus (DoF) and field-by-field focusing capabilities to achieve the desire CD fidelity. In addition to robust imaging and focusing capabilities the lithography tools must also provide sufficient overlay capabilities to overcome process challenges unique to MEMS/LED/ABS technologies. The scope of this work will be limited to the photolithography challenges associated with MEMS/LED/ABS manufacturing.