DocumentCode :
227703
Title :
Sponsors
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
1
Lastpage :
3
Abstract :
The conference organizers greatly appreciate the support of the various corporate sponsors listed.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL, USA
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892255
Filename :
6892255
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=227703
