DocumentCode
227705
Title
Table of contents
fYear
2014
fDate
27-30 May 2014
Firstpage
1
Lastpage
14
Abstract
The following topics are dealt with: thermal management; heat spreading; LED packaging; multi-chip-module; stacked die; solders; thermal interface materials; hydrophilicity; hydrophobicity; evaporation; heat pipes; phononics; cooling; heat exchangers; nanoscale heat transport; heat sinks; phase change material; reliability; near junction thermal transport; power electronics and thermoelectrics.
Keywords
evaporation; heat exchangers; heat pipes; heat sinks; hydrophilicity; hydrophobicity; light emitting diodes; multichip modules; phase change materials; power electronics; reliability; solders; thermal management (packaging); thermoelectric cooling; thermoelectricity; LED packaging; cooling; evaporation; heat exchanger; heat pipe; heat sink; heat spreading; hydrophilicity; hydrophobicity; multichip-module; nanoscale heat transport; near junction thermal transport; phase change material; phononics; power electronics; reliability; solder; stacked die; thermal interface material; thermal management; thermoelectrics;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2014.6892256
Filename
6892256
Link To Document