• DocumentCode
    2277160
  • Title

    Efficient FDC based on hierarchical tool condition monitoring scheme

  • Author

    Blue, Jakey ; Roussy, Agnès ; Thieullen, Alexis ; Pinaton, Jacques

  • Author_Institution
    Dept. of Sci. of Fabrication & Logistics, EMSE-CMP, Gardanne, France
  • fYear
    2012
  • fDate
    15-17 May 2012
  • Firstpage
    359
  • Lastpage
    364
  • Abstract
    Tool condition evaluation and prognosis has been an arduous challenge in modern semiconductor manufacturing environment, especially for the foundry and analog companies with high product-mix and complicated technology nodes. More and more embedded and external sensors are installed to capture the genuine tool status for tool fault identification and, thus, tool condition analysis based on real-time equipment data becomes promising but also much more complex with the rapidly-increased number of sensors. In this paper, the feasibility of Generalized Moving Variance (GMV) technique is validated to consolidate the pure variations within tool Fault Detection and Classification (FDC) data into one indicator. Based on GMV, a hierarchical tool condition monitor scheme is developed by analyzing the GMV within functional clusters of sensors. With the introduction of this hierarchy, abnormal tool condition can be diagnosed and drilled down into sensor level for an efficient root cause analysis.
  • Keywords
    condition monitoring; electric sensing devices; embedded systems; fault diagnosis; principal component analysis; semiconductor device manufacture; FDC data; GMV technique; analog companies; complicated technology nodes; embedded sensors; external sensors; foundry companies; generalized moving variance technique; hierarchical tool condition monitoring scheme; prognosis; real-time equipment data; root cause analysis; semiconductor manufacturing environment; sensor level; sensors functional clusters; tool condition analysis; tool condition evaluation; tool fault detection and classification data; tool fault identification; Maintenance engineering; Manufacturing; Monitoring; Principal component analysis; Radio frequency; Temperature sensors; Fault Detection and Classification (FDC); generalized variance; moving variance and covariance; principal component analysis; tool condition hierarchy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4673-0350-7
  • Type

    conf

  • DOI
    10.1109/ASMC.2012.6212927
  • Filename
    6212927