Embedded wafer level ball grid array (eWLB)

Wafer level packaging is gaining tremendous interest throughout the semiconductor industry, due to advantages in cost and performance. We report an embedded device technology, which is based on a molded 200 mm reconfigured wafer. Our approach is a way around the restrictions of standard wafer level packages, like the number of I/Os possible at a given pitch. This allows us to establish a broad packaging platform based on wafer level processes. The core process of this technology is the encapsulation of silicon dice. We demonstrate that compression molding is a promising approach for the embedding of devices with respect to topology, adhesion and reliability properties. The new technology we present here is a competitive solution delivering reliable ball grid array (BGA) packages.