• DocumentCode
    227749
  • Title

    Phosphor temperature reduction by optimizing the phosphor configuration in white light-emitting diode package

  • Author

    Run Hu ; Jinyan Hu ; Xiaobing Luo

  • Author_Institution
    Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    182
  • Lastpage
    185
  • Abstract
    Thermal management for white light-emitting diode (LED) packages is of great importance. Conventional thermal management methods mainly focus on the outside of LED package, but we, in this study, focused on the thermal management inside the LED package. Besides the heat generated in LED chips, we also consider the phosphor heat generation, which is calculated by Kubelka-Munk theory. We analyzed the effect of phosphor particle distribution on the thermal behaviors of LED packages. Two kinds of phosphor sizes, i.e. 5 μm and 7 μm, were applied for configuration optimization. Finite-element method (FEM) was adopted to simulate three cases. It is found that when the upper phosphor layer has larger concentration, the phosphor temperature is higher but the light extraction efficiency (LEE) is lower; when the lower phosphor layer has larger concentration, the phosphor temperature is lower but the LEE is higher. The phosphor temperature uniformity can be enhanced by 0.22% when the concentration of the lower phosphor layer is larger. Phosphor sedimentation, although deteriorates the optical performance, benefits the thermal behaviors on the contrary. There is a compromise that the thermal behaviors and optical performance seem to be inconsistent for different phosphor configurations.
  • Keywords
    finite element analysis; light emitting diodes; phosphors; thermal management (packaging); Kubelka-Munk theory; finite-element method; heat generation; light extraction efficiency; phosphor configuration; phosphor particle distribution; phosphor sedimentation; phosphor temperature reduction; size 5 mum to 7 mum; thermal behaviors; thermal management; white light-emitting diode package; Finite element analysis; Heating; Light emitting diodes; Optical scattering; Phosphors; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892279
  • Filename
    6892279