Title :
Phosphor temperature reduction by optimizing the phosphor configuration in white light-emitting diode package
Author :
Run Hu ; Jinyan Hu ; Xiaobing Luo
Author_Institution :
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
Thermal management for white light-emitting diode (LED) packages is of great importance. Conventional thermal management methods mainly focus on the outside of LED package, but we, in this study, focused on the thermal management inside the LED package. Besides the heat generated in LED chips, we also consider the phosphor heat generation, which is calculated by Kubelka-Munk theory. We analyzed the effect of phosphor particle distribution on the thermal behaviors of LED packages. Two kinds of phosphor sizes, i.e. 5 μm and 7 μm, were applied for configuration optimization. Finite-element method (FEM) was adopted to simulate three cases. It is found that when the upper phosphor layer has larger concentration, the phosphor temperature is higher but the light extraction efficiency (LEE) is lower; when the lower phosphor layer has larger concentration, the phosphor temperature is lower but the LEE is higher. The phosphor temperature uniformity can be enhanced by 0.22% when the concentration of the lower phosphor layer is larger. Phosphor sedimentation, although deteriorates the optical performance, benefits the thermal behaviors on the contrary. There is a compromise that the thermal behaviors and optical performance seem to be inconsistent for different phosphor configurations.
Keywords :
finite element analysis; light emitting diodes; phosphors; thermal management (packaging); Kubelka-Munk theory; finite-element method; heat generation; light extraction efficiency; phosphor configuration; phosphor particle distribution; phosphor sedimentation; phosphor temperature reduction; size 5 mum to 7 mum; thermal behaviors; thermal management; white light-emitting diode package; Finite element analysis; Heating; Light emitting diodes; Optical scattering; Phosphors; Thermal management;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
DOI :
10.1109/ITHERM.2014.6892279