Title :
Overview and emerging challenges in mechanical dicing of silicon wafers
Author :
Ganesh, V.P. ; Lee, Charles
Author_Institution :
Infineon Technol. Asia Pacific Pte Ltd., Singapore
Abstract :
An overview and emerging challenges in mechanical dicing of silicon (Si) wafer are discussed from view point of narrow kerf, thin wafer, chip strength enhancement, Copper (Cu)/low-k wafers and dicing challenges for emerging technologies.
Keywords :
integrated circuit technology; manufacturing processes; Cu; chip strength enhancement; low-k wafers; mechanical dicing; narrow kerf; silicon wafers; thin wafer; Assembly; Blades; CMOS technology; Copper; Packaging machines; Semiconductor device packaging; Silicon; Space technology; Stacking; Wafer scale integration;
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
DOI :
10.1109/EPTC.2006.342684
