DocumentCode
2277642
Title
Moisture absorption mechanism in epoxy molding compounds used in IC encapsulation
Author
Premkumar, Jeromerajan ; Srikanth, Narasimalu
Author_Institution
ASM Technol. Singapore
fYear
2006
fDate
6-8 Dec. 2006
Firstpage
60
Lastpage
62
Abstract
In this article the effects of moisture absorption on a novel epoxy molding compounds are quantitatively identified, based on the changes of its corresponding weight before and after moisture absorption. The experimental results reveals that the absorbed moisture (water) acts predominantly as a crazing agent, continuously increasing the weight of the epoxy by applying more pressure of the moistures related with temperature. The possible water adsorption places on the epoxy molding compounds are suggested.
Keywords
encapsulation; integrated circuit packaging; moisture; moulding; polymers; IC encapsulation; crazing agent; epoxy molding compounds; moisture absorption mechanism; Absorption; Consumer electronics; Encapsulation; Humidity; Moisture; Polymers; Resins; Steady-state; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location
Singapore
Print_ISBN
1-4244-0664-1
Electronic_ISBN
1-4244-0665-X
Type
conf
DOI
10.1109/EPTC.2006.342691
Filename
4147220
Link To Document