Abstract :
Conference proceedings front matter may contain various advertisements, welcome messages, committee or program information, and other miscellaneous conference information. This may in some cases also include the cover art, table of contents, copyright statements, title-page or half title-pages, blank pages, venue maps or other general information relating to the conference that was part of the original conference proceedings.
Keywords :
electrostatic discharge; micromechanical devices; semiconductor device models; semiconductor heterojunctions; semiconductor process modelling; technology CAD (electronics); AC analysis; ESD; MEMS; TCAD applications; advanced circuit modeling; algorithms; atomistic modeling; device modeling; device performance; fluctuation simulation; heterostructure simulation; numerics; physical modeling; process modeling; quantum transport modeling; semiconductor device simulation; semiconductor process simulation;
