Title :
Piranha Pin-Fins (PPF): Voracious boiling heat transfer by vapor venting from microchannels - system calibration and single-phase fluid dynamics
Author :
Woodcock, Corey ; Houshmand, Farzad ; Plawsky, Joel ; Izenson, Michael ; Fogg, David ; Hill, Richard ; Phillips, Scott ; Peles, Yoav
Author_Institution :
Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
A novel approach to embedded electronics cooling with a multi-phase microfluidic heat sink termed the Piranha Pin-Fin (PPF) is presented. Several first-generation PPF devices, as well as plain-channel and solid pin-fin heat sinks, have been fabricated and experimentally tested under single-phase adiabatic conditions. Details of the PPF device geometry and microfabrication process are provided. Plots showing pressure drop and friction factor are also provided. Numerical fluid dynamics modeling has been performed in parallel to the experiments. Modeling data presented includes fractional flow through the pins, predicted pressure losses, fluid streamlines and velocity gradients under several operating conditions. Additionally, micro-particle image velocimetry (μPIV) measurements have been performed. The velocity fields are used to provide further insight into the fluid mechanics within the heat sink as well as to validate the models. Velocity field measurements are included for various operating conditions.
Keywords :
boiling; cooling; electronics packaging; fluid dynamics; heat sinks; microfabrication; microfluidics; velocity measurement; PPF device geometry; boiling heat transfer; embedded electronics cooling; first-generation PPF devices; fluid mechanics; fluid streamlines; microchannels; microfabrication process; microparticle image velocimetry measurements; multiphase microfluidic heat sink; numerical fluid dynamics modeling; piranha pin-fins; plain-channel heat sinks; single-phase adiabatic conditions; single-phase fluid dynamics; solid pin-fin heat sinks; system calibration; velocity field measurements; velocity gradients; Arrays; Fluids; Friction; Heat sinks; Pins; Silicon; Transducers; CFD; boiling; cooling; friction factor; microfabrication; microfluidics; pin-fin; velocimetry;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
DOI :
10.1109/ITHERM.2014.6892294