Title :
Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries
Author :
Agonafer, Damena D. ; Lopez, Ken ; Yoonjin Won ; Palko, James ; Asheghi, Mehdi ; Santiago, Juan G. ; Goodson, Kenneth E.
Author_Institution :
Mech. Eng. Dept., Stanford Univ., Stanford, CA, USA
Abstract :
Phase separation in two-phase microfluidic exchangers is a promising strategy for reducing the required pumping power. Past research has focused on using hydrophobic nanoporous structures in order to extract water vapor and retain liquid within the vapor-cooling device. This study focuses on characterizing the bursting pressure, the maximum Laplace pressure for liquid containment, of nanoporous alumina membranes and micro-glass capillaries. The pore size diameters of the alumina membranes have a nominal diameter of 170 nm that can produce a pressure drop of 1.5 kPa for wetting dielectric liquids. In order to contain higher Laplace pressures, the pore geometry for ´pinning´ of the fluid at the liquid-vapor interface needs to be optimized. Single glass micro-glass capillaries were used in order to study the ´pinning effect´ of wetting fluids for various micro-capillary diameters. The glass capillary diameters ranged from 250-840 μm with measured Laplace pressures up to ~0.9 kPa. Experimental results agreed well with an analytical model that calculates the Laplace pressure as a function of pore geometry.
Keywords :
cooling; liquid-vapour transformations; membranes; microfluidics; nanoporous materials; phase separation; two-phase flow; bursting pressure; dielectric liquids; hydrophobic nanoporous structures; liquid containment; liquid-vapor interface; maximum Laplace pressure; micro-glass capillaries; microcapillary diameters; nanoporous alumina membranes; phase separation; pinning effect; pore geometry; pressure 1.5 kPa; single glass microglass capillaries; size 170 nm; size 250 mum to 840 mum; two-phase microfluidic exchangers; vapor-cooling device; water vapor; wetting fluids; Aluminum oxide; Geometry; Glass; Heating; Liquids; Surface tension; Burst Pressure Physics; High-Heat Flux Electronic Applications; Interfacial Nanoscale Transport; Microfluidics; Two-Phase Evaporative Cooling;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
DOI :
10.1109/ITHERM.2014.6892297