DocumentCode :
227794
Title :
Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement
Author :
Yoonjin Won ; Barako, Michael T. ; Agonafer, Damena D. ; Asheghi, Mehdi ; Goodson, Kenneth E.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
326
Lastpage :
332
Abstract :
Nanoengineered structures have received significant attention due to the application of porous media convection structures. Metal porous structures provide unique combinations of large surface to volume ratio, high conductivity, and mechanical compliance. The integration of metal porous structures can improve the performance of convective heat exchangers for high heat flux thermal management. Copper inverse opals (CIOs) are more attractive because their geometry can be precisely controlled and determined at the pore level. This study reports a combination of experiments, simulations, and analytical models to understand the mechanical and thermal properties of CIOs coupled with structural information. Detailed image analysis to quantify the porosity and pore geometry is followed. The mechanical modulus and thermal conductivity of CIOs show a strong dependence on the porosity. The mechanical compliance of 20-50 GPa and high thermal conductivity of ~100 W/mK are promising for a variety of applications including microchannels applications.
Keywords :
convection; copper; flow through porous media; heat exchangers; microchannel flow; nanofluidics; porosity; thermal conductivity; two-phase flow; CIO; analytical models; convective heat exchanger performance; copper inverse opals; heat flux thermal management; image analysis; mechanical compliance; mechanical modulus; mechanical properties; metal porous structures; microchannel applications; nanoengineered structures; pore geometry; pore level; porosity; porous media convection structures; structural information; surface to volume ratio; thermal conductivity; thermal properties; two-phase convection enhancement; Conductivity; Copper; Films; Heating; Mathematical model; Resonant frequency; Thermal conductivity; inverse opal; modulus; nanoengineered structures; porous structures; thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892299
Filename :
6892299
Link To Document :
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