Title :
A numerical approach towards the correlation between ball impact test and drop reliability
Author :
Yeh, Chang-Lin ; Lai, Yi-Shao
Author_Institution :
Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Nantze
Abstract :
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around the intermetallics, similar to that from a board-level drop test. In this paper, both board-level drop test and package-level ball impact test are examined numerically for solder joints of nine Sn-Ag-Cu solder compositions. Correlations between the drop reliability and characteristics of the impact force profile are sought
Keywords :
chip-on-board packaging; circuit reliability; copper alloys; impact testing; silver alloys; solders; tin alloys; Sn-Ag-Cu; ball impact test; correlation; drop reliability; impact force profile; package level measure; solder joints; Bonding; Electronics packaging; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Semiconductor device reliability; Semiconductor device testing; Shearing; Soldering; Vehicle dynamics;
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
DOI :
10.1109/EPTC.2006.342709
