• DocumentCode
    2278068
  • Title

    Simulation of substrate currents

  • Author

    Schoenmaker, Wim ; Meuris, Peter ; Magnus, Wim ; Maleszka, Bert

  • Author_Institution
    IMEC, Heverlee, Belgium
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    79
  • Lastpage
    82
  • Abstract
    Recently a new approach was presented to determine the high-frequency response of on-chip passive components and interconnects. The method solves the electric scalar and magnetic vector potentials in a prescribed gauge. The latter one is included by introducing an additional independent scalar field, whose field equation needs to be solved. This additional field is a mathematical aid that allows for the construction of a gauge-conditioned, regular matrix representation of the curl-curl operator acting on edge elements. This paper reports on the convergence properties of the new method and shows the first results of this new calculation scheme for VLSI-based structures at high frequencies. The high-frequent behavior of the substrate current, the skin effect and current crowding is evaluated.
  • Keywords
    convergence; field equations; gauge field theory; high-frequency effects; integrated circuit interconnections; integrated circuit modelling; skin effect; substrates; very high speed integrated circuits; VLSI-based structures; convergence properties; curl-curl operator; current crowding; edge elements; electric scalar potentials; field equation; gauge-conditioned regular matrix representation; high-frequency response; magnetic vector potentials; on chip interconnects; on-chip passive components; scalar field; skin effect; substrate currents; Convergence; Electrodynamics; Frequency domain analysis; Geometry; Linear systems; Physics; Poisson equations; Proximity effect; Skin effect; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2002. SISPAD 2002. International Conference on
  • Print_ISBN
    4-89114-027-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2002.1034521
  • Filename
    1034521