DocumentCode
2278170
Title
Transistor width dependence of LER degradation to CMOS device characteristics
Author
Wu, Jeff ; Chen, Jihong ; Liu, Kaiping
Author_Institution
Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
fYear
2002
fDate
2002
Firstpage
95
Lastpage
98
Abstract
When transistor gate length is scaled down, the impact of transistor poly gate line edge roughness (LER) on device characteristics becomes significant. In this work, we study the dependence on transistor width of the low spatial frequency LER induced CMOS device Ion/Ioff degradations, based on TCAD simulation results and silicon data. Methodology to account for LER effects in device optimization is also discussed. We found that when the transistor width becomes comparable to the LER spatial period, the resulting transistor Ion/Ioff degradation presents a very different signature from that of wide transistor cases. We found that for narrow width transistors, the scatter clouds on the Ion/Ioff plot stretch out along the Ion/Ioff curve direction and compress vertically toward the ideal Ion/Ioff curve resulting in transistor parametric yield loss.
Keywords
CMOS integrated circuits; MOSFET; integrated circuit modelling; semiconductor device models; CMOS device characteristics; LER degradation; TCAD simulation; device characteristics; device optimization; narrow width transistors; scatter clouds; transistor gate length; transistor parametric yield loss; transistor poly gate line edge roughness; transistor width dependence; CMOS technology; Clouds; Degradation; Frequency; Instruments; Intrusion detection; Optimization methods; Scattering; Shape; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2002. SISPAD 2002. International Conference on
Print_ISBN
4-89114-027-5
Type
conf
DOI
10.1109/SISPAD.2002.1034525
Filename
1034525
Link To Document