DocumentCode :
227835
Title :
Application of Vorpal software to carrier modeling in solid state devices
Author :
Smithe, David ; Dimitrov, Dimitre ; Meiser, Dominic
Author_Institution :
Tech-X Corp., Boulder, CO, USA
fYear :
2014
fDate :
25-29 May 2014
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. We use the particle-in-cell software, Vorpal, to model carrier dynamics in solid-state devices. We re-purpose existing electrostatic and electromagnetic field solvers, developed for vacuum electronics modeling to provide the electric field for semi-conductor modeling. Statistical and deterministic particle dynamics work together to provide the physics of mobility, drift, phonon collisions, and diffusion. Novel particle species are used, which involve phase space variables for quantum mechanical energy and momentum vector, and valley information as well. Barrier potentials for emission, and source models for metallic and Schottky junctions are provided. Much of this work derives from study of GaAs and diamond emitters for high brightness accelerator sources [1,2]. Here, though, we examine more traditional devices, such as diodes and transistors, with an emphasis on creating examples and benchmarks to aid in future use of the software in this broader area. We also look at future plans for more generalized capabilities, geometries and different types of semi-conductor materials, and configurations, including thin layer effects.
Keywords :
III-V semiconductors; Schottky diodes; gallium arsenide; semiconductor device models; vacuum microelectronics; GaAs; Schottky junctions; Vorpal software; carrier dynamics model; deterministic particle dynamics; diamond emitters; electric field; electromagnetic field solvers; momentum vector; particle-in-cell software; phase space variables; quantum mechanical energy; semiconductor modeling; solid state devices; statistical particle dynamics; thin layer effects; vacuum electronics modeling; valley information; Diamonds; Electrostatics; Gallium arsenide; Physics; Software; Solid modeling; Solids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Sciences (ICOPS) held with 2014 IEEE International Conference on High-Power Particle Beams (BEAMS), 2014 IEEE 41st International Conference on
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4799-2711-1
Type :
conf
DOI :
10.1109/PLASMA.2014.7012563
Filename :
7012563
Link To Document :
بازگشت