Title :
Electrochemical behavior of a new Sn3.5Ag0.5Cu composite solder
Author :
Tsao, L.C. ; Lo, T.T. ; Peng, S.F. ; Chang, S.Y.
Author_Institution :
Dept. of Mater. Eng., Pingtung Univ. of Sci. & Technol., Pingtung, Taiwan
Abstract :
For application of a lead-free composite solder in advanced electrical components, lead-free Sn3.5Ag0.5Cu composite solder was produced by mechanically mixing 0.5 wt.% nano-TiO2 particles with Sn3.5Ag0.5Cu solder. The corrosion behavior of the new Sn3.5Ag0.5Cu composite solder in 3.5 wt.% NaCl solution was investigated by using potentiodynamic polarization methods. The corrosion products formed during the polarization study were analyzed with scanning electron microscopy (SEM) and X-ray diffraction. Potentiodynamic polarization curves show that the new Sn3.5Ag0.5Cu composite solder exhibits better corrosion resistance than Sn3.5Ag0.5Cu solder. The corrosion product on the surface of all these solders was tin oxide chloride hydroxide.
Keywords :
X-ray diffraction; copper alloys; corrosion; electrochemical analysis; scanning electron microscopy; silver alloys; sodium compounds; solders; tin alloys; titanium compounds; NaCl; SnAgCu; TiO2; X-ray diffraction; composite solder; corrosion behavior; electrochemical behavior; potentiodynamic polarization; scanning electron microscopy; Corrosion; Current density; Lead; Materials; Microstructure; Tin;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582623
