Electrochemical behavior of a new Sn3.5Ag0.5Cu composite solder

Author

Tsao, L.C. ; Lo, T.T. ; Peng, S.F. ; Chang, S.Y.

Author_Institution

Dept. of Mater. Eng., Pingtung Univ. of Sci. & Technol., Pingtung, Taiwan

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

1013

Lastpage

1017

Abstract

For application of a lead-free composite solder in advanced electrical components, lead-free Sn3.5Ag0.5Cu composite solder was produced by mechanically mixing 0.5 wt.% nano-TiO₂ particles with Sn3.5Ag0.5Cu solder. The corrosion behavior of the new Sn3.5Ag0.5Cu composite solder in 3.5 wt.% NaCl solution was investigated by using potentiodynamic polarization methods. The corrosion products formed during the polarization study were analyzed with scanning electron microscopy (SEM) and X-ray diffraction. Potentiodynamic polarization curves show that the new Sn3.5Ag0.5Cu composite solder exhibits better corrosion resistance than Sn3.5Ag0.5Cu solder. The corrosion product on the surface of all these solders was tin oxide chloride hydroxide.

Keywords

X-ray diffraction; copper alloys; corrosion; electrochemical analysis; scanning electron microscopy; silver alloys; sodium compounds; solders; tin alloys; titanium compounds; NaCl; SnAgCu; TiO₂; X-ray diffraction; composite solder; corrosion behavior; electrochemical behavior; potentiodynamic polarization; scanning electron microscopy; Corrosion; Current density; Lead; Materials; Microstructure; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582623

Filename

5582623