Title :
Study and modeling of interconnection in high-speed circuit
Author :
Cao, Qunsheng ; He, Xiang
Author_Institution :
Coll. of Electron. & Inf. Eng., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
Abstract :
Since interconnection has become an essential component in high-speed integrated circuits (IC), it is of great importance to explore and investigate its electrical characteristics. This paper is summarized our recent work on high-speed interconnection in both 2D planar IC and 3D IC. First, we have build up distributed circuit model for differential microstrip line and vias system, then crosstalk of non-parallel transmission line has been studied and reduced with the using of serpentine guard trace; Second, we have explored the electrical characteristics of through silicon via (TSV).
Keywords :
integrated circuit interconnections; integrated circuit modelling; microstrip lines; three-dimensional integrated circuits; 2D planar IC; 3D IC; TSV; differential microstrip line; distributed circuit model; high-speed integrated circuits; high-speed interconnection modeling; nonparallel transmission line crosstalk; through silicon via; vias system; Integrated circuit interconnections; Integrated circuit modeling; Microstrip; Silicon; Three dimensional displays; Through-silicon vias;
Conference_Titel :
High Speed Intelligent Communication Forum (HSIC), 2012 4th International
Conference_Location :
Nanjing, Jiangsu
Print_ISBN :
978-1-4673-0678-2
Electronic_ISBN :
978-1-4673-0676-8
DOI :
10.1109/HSIC.2012.6213009
