DocumentCode :
2278513
Title :
Transient analysis and experimental validation of thermal-fluidic fields on TFT-LCD TV panels
Author :
Chu, Chung-Yi ; Pan, Min-Chun
Author_Institution :
Dept. of Mech. Eng., Nat. Central Univ., Chung-li
fYear :
2006
fDate :
6-8 Dec. 2006
Firstpage :
346
Lastpage :
352
Abstract :
The study aims at investigating the fluidic and thermal fields at the vertical section of a 23-inch commercial TFT-LCD TV panel through both numerical simulation and experimental validation. Twelve cold cathode fluorescent lamps (CCFLs) of backlight module of TFT-LCD panel are located in the vertical-trapezium enclosure space from top to down. The CCFLs heat up ambient air by heat conduction and form plume flow by buoyancy and gravity. Because of these CCFLs´ influence, natural convection phenomenon exits in the backlight module. The simulation of temperature distribution for transient and steady state is done with conditions of two dimensional laminar flow and incompressible properties in the natural convection. Subsequently, the temperature distribution on the TV panel is compared via heat conduction. The study conducts a reliable verification process. The transient temperature distribution in the direct-type backlight module and LCD panel is measured by K-type thermocouples. Based on the measurement, the buoyancy effect and flow field that influence the direct-type backlight module are further discussed
Keywords :
cathodes; fluorescent lamps; laminar flow; liquid crystal displays; natural convection; temperature distribution; thermocouples; thin film transistors; transient analysis; 2D laminar flow; K-type thermocouples; TFT-LCD TV panels; backlight module; buoyancy effect; cold cathode fluorescent lamps; flow field; heat conduction; heat up ambient air; natural convection phenomenon; plume flow; thermal-fluidic fields; transient analysis; transient temperature distribution; Computational fluid dynamics; Fluid flow measurement; Heat transfer; Shape; Space heating; TV; Temperature distribution; Thermal conductivity; Thermal engineering; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
Type :
conf
DOI :
10.1109/EPTC.2006.342741
Filename :
4147270
Link To Document :
بازگشت