Short time die attach characterization of leds for in-line testing application

The qualification of the die attach of light emitting diodes (LED) is a very important element of predicting the reliability of the package, as the temperature of the chip is strongly affected by the quality of the die attach. LED manufacturers are seeking for solutions to be able to test die attach quality in mass production. This paper describes our findings regarding LED package testing with a focus on die attach quality testing, necessary short measurement times only. Requirements against the physical testing and the further processing are shown based on our experimental findings.