Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy

Author

Wang, Yiqing ; Ding, Dongyan ; Liu, Ting ; Galuschki, Klaus-Peter ; Hu, Yu ; Gong, Angela ; Shen, Ming ; Sun, Hongqi ; Wang, Xianfeng ; Sun, Jiangyan ; Li, Ming ; Mao, Dali

Author_Institution

State Key Lab. of Metal Matrix Composites, Shanghai Jiao Tong Univ., Shanghai, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

980

Lastpage

983

Abstract

Electroplating matte Sn has attracted much attention in the lead-free age. To prevent a growth of tin whiskers from lead-frame supported matte tin films, various mitigation methods have been reported. In this work, pure matte Sn was electroplated onto C194 alloy, and electroplating Ni film was used as barrier between matte Sn and lead-frame alloy. The microstructures of the Ni/Sn depositions and tin whisker growth were investigated through using scanning electron microscope (SEM). It was found that the Ni barrier layer played an important role in suppressing the growth of tin whiskers.

Keywords

electroplated coatings; electroplating; elemental semiconductors; lead alloys; nickel; scanning electron microscopy; semiconductor growth; semiconductor thin films; tin; whiskers (crystal); Ni; Ni barrier layer effect; PbJkJk; SEM; Sn; electroplating; scanning electron microscope; tin whisker formation; Films; Morphology; Nickel; Surface morphology; Surface treatment; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582636

Filename

5582636