DocumentCode :
227874
Title :
Thermal conductivity reduction by nanophononic metamaterials
Author :
Davis, Bruce L. ; Hussein, Mahmoud I.
Author_Institution :
Dept. of Aerosp. Eng. Sci., Univ. of Colorado Boulder, Boulder, CO, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
632
Lastpage :
636
Abstract :
Engineered manipulation of phonons can yield beneficial thermal properties in semiconducting materials. One pivotal application relates to thermoelectric materials, or the concept of conversion of a temperature difference into an electric voltage and vice-versa. The ability to use nanostructuring to reduce the thermal conductivity without negatively impacting the power factor provides a promising avenue for achieving high values of the thermoelectric energy conversion figure-of-merit, ZT. In this work, we propose a novel nanostructured material configuration that seeks to achieve this goal. Termed "nanophononic metamaterial," the configuration is based on a silicon thin-film with a periodic array of pillars erected on one or two of the free surfaces. The pillars qualitatively alter the base thin-film phonon spectrum due to a hybridization mechanism between their local resonances and the underlying atomic lattice dispersion. Using an experimentally-fitted lattice dynamics- based model, we conservatively predict a drop in the thermal conductivity to as low as 50% of the corresponding uniform thin-film value despite the fact that the pillars add more phonon modes to the spectrum.
Keywords :
elemental semiconductors; lattice dynamics; metamaterials; semiconductor thin films; silicon; thermal conductivity; thermoelectric power; atomic lattice dispersion; engineered manipulation; experimentally-fitted lattice dynamics; hybridization mechanism; nanophononic metamaterials; nanostructured material configuration; periodic pillar array; power factor; semiconducting materials; silicon thin film; thermal conductivity reduction; thermoelectric energy conversion; thermoelectric materials; thin-film phonon spectrum; Materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892340
Filename :
6892340
Link To Document :
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