• DocumentCode
    227874
  • Title

    Thermal conductivity reduction by nanophononic metamaterials

  • Author

    Davis, Bruce L. ; Hussein, Mahmoud I.

  • Author_Institution
    Dept. of Aerosp. Eng. Sci., Univ. of Colorado Boulder, Boulder, CO, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    632
  • Lastpage
    636
  • Abstract
    Engineered manipulation of phonons can yield beneficial thermal properties in semiconducting materials. One pivotal application relates to thermoelectric materials, or the concept of conversion of a temperature difference into an electric voltage and vice-versa. The ability to use nanostructuring to reduce the thermal conductivity without negatively impacting the power factor provides a promising avenue for achieving high values of the thermoelectric energy conversion figure-of-merit, ZT. In this work, we propose a novel nanostructured material configuration that seeks to achieve this goal. Termed "nanophononic metamaterial," the configuration is based on a silicon thin-film with a periodic array of pillars erected on one or two of the free surfaces. The pillars qualitatively alter the base thin-film phonon spectrum due to a hybridization mechanism between their local resonances and the underlying atomic lattice dispersion. Using an experimentally-fitted lattice dynamics- based model, we conservatively predict a drop in the thermal conductivity to as low as 50% of the corresponding uniform thin-film value despite the fact that the pillars add more phonon modes to the spectrum.
  • Keywords
    elemental semiconductors; lattice dynamics; metamaterials; semiconductor thin films; silicon; thermal conductivity; thermoelectric power; atomic lattice dispersion; engineered manipulation; experimentally-fitted lattice dynamics; hybridization mechanism; nanophononic metamaterials; nanostructured material configuration; periodic pillar array; power factor; semiconducting materials; silicon thin film; thermal conductivity reduction; thermoelectric energy conversion; thermoelectric materials; thin-film phonon spectrum; Materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892340
  • Filename
    6892340