DocumentCode
227874
Title
Thermal conductivity reduction by nanophononic metamaterials
Author
Davis, Bruce L. ; Hussein, Mahmoud I.
Author_Institution
Dept. of Aerosp. Eng. Sci., Univ. of Colorado Boulder, Boulder, CO, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
632
Lastpage
636
Abstract
Engineered manipulation of phonons can yield beneficial thermal properties in semiconducting materials. One pivotal application relates to thermoelectric materials, or the concept of conversion of a temperature difference into an electric voltage and vice-versa. The ability to use nanostructuring to reduce the thermal conductivity without negatively impacting the power factor provides a promising avenue for achieving high values of the thermoelectric energy conversion figure-of-merit, ZT. In this work, we propose a novel nanostructured material configuration that seeks to achieve this goal. Termed "nanophononic metamaterial," the configuration is based on a silicon thin-film with a periodic array of pillars erected on one or two of the free surfaces. The pillars qualitatively alter the base thin-film phonon spectrum due to a hybridization mechanism between their local resonances and the underlying atomic lattice dispersion. Using an experimentally-fitted lattice dynamics- based model, we conservatively predict a drop in the thermal conductivity to as low as 50% of the corresponding uniform thin-film value despite the fact that the pillars add more phonon modes to the spectrum.
Keywords
elemental semiconductors; lattice dynamics; metamaterials; semiconductor thin films; silicon; thermal conductivity; thermoelectric power; atomic lattice dispersion; engineered manipulation; experimentally-fitted lattice dynamics; hybridization mechanism; nanophononic metamaterials; nanostructured material configuration; periodic pillar array; power factor; semiconducting materials; silicon thin film; thermal conductivity reduction; thermoelectric energy conversion; thermoelectric materials; thin-film phonon spectrum; Materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2014.6892340
Filename
6892340
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