Title :
Analysis of application status about microwave devices
Author :
Li, Ping ; Cui, Xiao-Ying ; Lai, Ping
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component, MIIT, Guangzhou, China
Abstract :
The analysis of failure status on microwave devices in recent years have been analysed in this paper. Statistic distribution of sort and the main failure mechanisms on micro-wave devices in application have been obtained. And correspond control methods were introduced.
Keywords :
failure analysis; microwave devices; statistical distributions; failure status; microwave devices; statistic distribution; Electromagnetic heating; Microwave FET integrated circuits; Microwave circuits; Microwave devices; Microwave integrated circuits; Reliability;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582642
