DocumentCode
2278772
Title
Analysis of application status about microwave devices
Author
Li, Ping ; Cui, Xiao-Ying ; Lai, Ping
Author_Institution
Nat. Key Lab. of Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component, MIIT, Guangzhou, China
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
965
Lastpage
967
Abstract
The analysis of failure status on microwave devices in recent years have been analysed in this paper. Statistic distribution of sort and the main failure mechanisms on micro-wave devices in application have been obtained. And correspond control methods were introduced.
Keywords
failure analysis; microwave devices; statistical distributions; failure status; microwave devices; statistic distribution; Electromagnetic heating; Microwave FET integrated circuits; Microwave circuits; Microwave devices; Microwave integrated circuits; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582642
Filename
5582642
Link To Document