Determination of Lumped Element Package Model for Radio Frequency Surface Acoustic Wave Device Using Neural Network Techniques

Author

Wang, Shuming T. ; Xie, Zhi-Feng ; Liu, Tzu-Te ; Hwang, Rey-Chue

Author_Institution

I-Shou Univ., Kaohsiung

fYear

2007

fDate

27-31 May 2007

Firstpage

763

Lastpage

766

Abstract

Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. In this paper, neural network was employed to determine the lumped element models of bonding pads. As an example, an RF SAW filter used in GPS system was examined. The result showed a good agreement with that obtained from full wave EM simulator.

Keywords

Global Positioning System; electronics packaging; lumped parameter networks; neural nets; radiofrequency filters; surface acoustic wave filters; GPS system; RF SAW filter; SAW simulation; bonding pads; electronic packaging; full wave EM simulator; lumped element package model; neural networks; radio frequency surface acoustic wave device; Acoustic waves; Bonding; Circuit simulation; Global Positioning System; Neural networks; Packaging; Radio frequency; SAW filters; Surface acoustic wave devices; Surface acoustic waves; Lumped Element Model; Neural Network; Package Effect; RF SAW;

fLanguage

English

Publisher

ieee

Conference_Titel

Applications of Ferroelectrics, 2007. ISAF 2007. Sixteenth IEEE International Symposium on

Conference_Location

Nara

ISSN

1099-4734

Print_ISBN

978-1-4244-1334-8

Electronic_ISBN

1099-4734

Type

conf

DOI

10.1109/ISAF.2007.4393395

Filename

4393395