DocumentCode :
227909
Title :
Thermal conduction in nanoporous copper inverse opal films
Author :
Barako, Michael T. ; Weisse, Jeffrey M. ; Roy, Sandip ; Kodama, Tomoya ; Dusseault, Thomas J. ; Motoyama, Mayumi ; Asheghi, Mehdi ; Prinz, Fritz B. ; Xiaolin Zheng ; Goodson, Kenneth E.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
736
Lastpage :
743
Abstract :
Copper inverse opal films offer an attractive combination of conduction and convection transport properties that yield a low total thermal resistance for microfluidic heat exchanger applications. In this work, we present an integrated synthesis and characterization strategy to fabricate nanoporous copper inverse opal films and to measure the effective thermal conductivity. We synthesize inverse opal films with sub-micron pore diameters using a sacrificial packed multilayer nanosphere bed to mold the geometry of an electrodeposited copper film. We characterize the effective thermal conductivity using the 3ω method, where the nanoporous copper film is deposited directly above a microfabricated and electrically-passivated 3ω device. The effective thermal conductivity is measured to be as large as 170 W m-1 K-1. This experimental data is compared to finite element simulations as well as common conduction models for heterogeneous media, including Maxwell´s model and differential effective medium theory. This provides insight into the design of nanoengineered surfaces and two-phase vapor-venting microfluidic heat exchangers for ultrahigh heat flux cooling.
Keywords :
copper; electrodeposits; heat exchangers; microfluidics; multilayers; nanoporous materials; thermal conductivity; thermal resistance; 3ω method; Maxwell model; conduction transport; convection transport; differential effective medium theory; finite element simulations; heterogeneous media; low total thermal resistance; nanoporous copper inverse opal films; sacrificial packed multilayer nanosphere bed; thermal conduction; thermal conductivity; two-phase vapor-venting microfluidic heat exchangers; ultrahigh heat flux cooling; Conductivity; Copper; Electrodes; Films; Heating; Substrates; Thermal conductivity; Langmuir-Blodgett; electrodeposition; inverse opal; thermal conductivity; three omega;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892354
Filename :
6892354
Link To Document :
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