• DocumentCode
    227917
  • Title

    Numerical investigation of underfloor obstructions in open-contained data center with fan curves

  • Author

    Alissa, H. ; Alkharabsheh, S. ; Bhopte, S. ; Sammakia, B.

  • Author_Institution
    Dept. of Mech. Eng., Binghamton Univ., Binghamton, NY, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    771
  • Lastpage
    777
  • Abstract
    The purpose of under floor plenum in a typical raised floor data center is to route the supply of cold air to perforated tiles in the cold aisles, and hence, to the racks. However, the presence of under floor chiller piping and various wiring may have an adverse effect on flow rates if not placed based on physical considerations; the pressure drop caused by chiller piping and under floor blockages has not been investigated thoroughly in modeling of a fully representative real life data center, and in particular, in applications where some or all of the cold aisles may be contained. This effect on flow rate is expected to be even more profound in contained systems; this study aims to address the effect of under floor obstructions on data center performance. It was shown that when having blockages in critical locations, containment can act as a solution for the inlet temperatures at the racks, however, the blockage effect can still be seen on the racks outlet and the CRAC return temperatures. It was also observed that inadequate distribution of those blockages led to a change in the operating point of both the CRAC and severs fan curve reducing the flow being fed to the IT equipment, and hence the chiller cooling load is expected to increase, which results in a thermal deficiency of the data center.
  • Keywords
    air conditioning; computer centres; fans; floors; flow; CRAC return temperatures; IT equipment; blockage effect; chiller cooling load; cold air; cold aisles; fan curve; flow rates; inlet temperatures; pressure drop; racks outlet; typical raised floor data center; under floor blockages; under floor chiller piping; under floor plenum; Computational fluid dynamics; Cooling; Floors; Layout; Servers; Temperature sensors; Underfloor obstructions; chiller piping; containment; fan curves; shallow plenum;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892359
  • Filename
    6892359