Optimization design of a 64-Lead Low-Profile Quad Flat Package for RFIC applications

Simple process and low cost are the two major advantages of lead frame package, but the application bandwidth has been limited by its fixed structure. Based on commercial electromagnetic analysis software HFSS, a standard 64-Lead Low-Profile Quad Flat Package was used to create optimized package model and its S parameters were simulated. Simulation results indicate that the optimized model has extended the RFIC package bandwidth to higher frequencies. The bandwidth measured for insertion loss (S31), return loss (S11), and coupling (S21) is 4.7GHz (at -1dB), 4.9GHz (at -15dB), and 2.7GHz (at -15dB). Compared with the standard LQFP64 package, we find that the bandwidth of S31, S11, and S21 is increased 34%, 58%, and 69% respectively.