Optimization design of a 64-Lead Low-Profile Quad Flat Package for RFIC applications

Author

Sun, Haiyan ; Wu, Jianhui ; Ling Sun ; Jing, Weiping

Author_Institution

Nat. ASIC Syst. Eng. Res. Center, Southeast Univ., Nanjing, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

499

Lastpage

502

Abstract

Simple process and low cost are the two major advantages of lead frame package, but the application bandwidth has been limited by its fixed structure. Based on commercial electromagnetic analysis software HFSS, a standard 64-Lead Low-Profile Quad Flat Package was used to create optimized package model and its S parameters were simulated. Simulation results indicate that the optimized model has extended the RFIC package bandwidth to higher frequencies. The bandwidth measured for insertion loss (S31), return loss (S11), and coupling (S21) is 4.7GHz (at -1dB), 4.9GHz (at -15dB), and 2.7GHz (at -15dB). Compared with the standard LQFP64 package, we find that the bandwidth of S31, S11, and S21 is increased 34%, 58%, and 69% respectively.

Keywords

S-parameters; circuit optimisation; integrated circuit design; integrated circuit packaging; radiofrequency integrated circuits; HFSS; RFIC package bandwidth; S parameters; electromagnetic analysis software; lead frame package; low-profile quad flat package; optimization design; Bandwidth; Couplings; Equivalent circuits; Integrated circuit modeling; Lead; Packaging; Radiofrequency integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582665

Filename

5582665