Exploring the ulthimo platform

A substrate level (matrix) single die packaging technology is used as the basis for an electronic packaging platform. This Ulthimo (ultra thin multi die outline) or nowadays called UTLP (ultra thin leadless package) technology was originally developed for high frequency transistor packaging. Onto its core process flow dedicated process modules are added to enable its use for packaging of more complex functionalities. The added process modules are chosen such that they fit on the base process flow without jeopardizing these base process steps. The platform based applications are multi-die packaging including vertical dies, 3-dimensional sensor packaging and biofluidic packaging