Stress analysis of Cu pad/solder interfaces

Author

Wang, Zhuoru ; Qin, Fei ; Xia, Guofeng

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

515

Lastpage

519

Abstract

Interfacial fracturing is the most important failure mode of solder joints. In this paper, interfacial stresses of Cu pad/solder interfaces are evaluated based on the theory of interfacial mechanics and the finite element method. Effects of solder joint shapes and solder materials on the stress intensity are investigated. The results show that Sn37Pb/Cu interface has greater stress intensity than that of Sn3.5Ag/Cu and Sn3.0Ag0.5Cu/Cu interfaces, a fatter solder shape increases the stress intensity. Elastic-plastic deformation and strain rate effects in the solder joints reduce the intensity.

Keywords

copper; electronics packaging; finite element analysis; solders; stress analysis; Cu; elastic-plastic deformation; finite element method; interfacial fracturing; interfacial mechanics; solder interfaces; solder joints; strain rate effects; stress analysis; Copper; Finite element methods; Load modeling; Materials; Shape; Soldering; Stress; Electronic Package; Finite Element Method; Interfacial Stress; Solder Joints;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582668

Filename

5582668