Title :
Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test
Author :
Wunderle, B. ; Springborn, M. ; May, Dominik ; Manier, C.-A. ; Abo Ras, M. ; Mrossko, R. ; Oppermann, H. ; Xhonneux, T. ; Caroff, T. ; Maurer, W. ; Mitova, R.
Author_Institution :
Chemnitz Univ. of Technol., Chemnitz, Germany
Abstract :
This paper deals with the system design, technology and test of a novel concept of integrating Silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement.
Keywords :
elemental semiconductors; modules; power convertors; silicon; thermal management (packaging); thermoelectric cooling; transient analysis; Cu; DCB assemblies; Si; copper bonded substrate; coupled-field simulations; double-sided cooling; joining technology; phase change heat buffer; power converter modules; silicon power dies; sintering; soldering; system design; thermal performance prediction; thermoelectric coolers; transient liquid phase bonding; transient thermo-electrical management; Cooling; Heating; Phase change materials; Thermal resistance; Transient analysis;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
DOI :
10.1109/ITHERM.2014.6892370
