Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test

Author

Wunderle, B. ; Springborn, M. ; May, Dominik ; Manier, C.-A. ; Abo Ras, M. ; Mrossko, R. ; Oppermann, H. ; Xhonneux, T. ; Caroff, T. ; Maurer, W. ; Mitova, R.

Author_Institution

Chemnitz Univ. of Technol., Chemnitz, Germany

fYear

2014

fDate

27-30 May 2014

Firstpage

851

Lastpage

861

Abstract

This paper deals with the system design, technology and test of a novel concept of integrating Silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement.

Keywords

elemental semiconductors; modules; power convertors; silicon; thermal management (packaging); thermoelectric cooling; transient analysis; Cu; DCB assemblies; Si; copper bonded substrate; coupled-field simulations; double-sided cooling; joining technology; phase change heat buffer; power converter modules; silicon power dies; sintering; soldering; system design; thermal performance prediction; thermoelectric coolers; transient liquid phase bonding; transient thermo-electrical management; Cooling; Heating; Phase change materials; Thermal resistance; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on

Conference_Location

Orlando, FL

ISSN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2014.6892370

Filename

6892370