Title :
A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications
Author :
Lingamneni, Srilakshmi ; Asheghi, Mehdi ; Goodson, Kenneth E.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
Abstract :
Metal-PCM (Phase Change Material) composite heat spreaders offer a combination of high effective thermal conductivity and high density heat storage capability that are desirable for transient thermal management applications, especially in mobile and wearable electronic devices. In this study, we propose fabrication of microporous metal matrix (MMM)-PCM composite heat spreaders through electrodeposition of metal over a template of PCM microcapsules that result in composites with metal volume fraction of ~ 0.26. Effective thermal conductivity of these composites equal 74 W/m. K and 44 W/m. K for copper matrix and aluminum matrix respectively. Order of magnitude analysis for time response and thermal energy storage utilization performed on metal-PCM composites, as a function of metal volume fraction, shows that the optimal metal volume fraction range is 0.2-0.5 for the best thermal performance of metal-PCM composite heat spreaders. Furthermore, the temperature response of the MMM-PCM composite heat spreaders to a heat input showed that the use of PCM within a metal matrix can hold the device skin temperature below the ergonomic limit for long durations of time without sacrificing the time response.
Keywords :
mobile handsets; phase change materials; thermal conductivity; thermal energy storage; thermal management (packaging); MMM-PCM composite heat spreader fabrication; PCM microcapsules template; aluminum matrix; copper matrix; device skin temperature response; ergonomic limit; high density heat storage capability; high effective thermal conductivity; magnitude analysis; metal electrodeposition; metal volume fraction; metal-PCM composite heat spreaders; microporous metal matrix PCM composite heat spreaders; mobile devices; phase change material; temperature response; thermal conductivity; thermal energy storage utilization; time response; transient thermal management applications; wearable electronic devices; Aluminum; Conductivity; Copper; Heating; Phase change materials; Thermal conductivity; Composite heat spreader; effective thermal conductivity; microporous metal matrix; phase change material; transient cooling;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
DOI :
10.1109/ITHERM.2014.6892372