Title :
IN/INS shorting due to surface ESD
Author_Institution :
Philips Semicond., Calamba
Abstract :
As semiconductor devices becomes smaller and smaller, more complex and sensitive to ESD, the manufacturing process gets more difficult. Manufacturing equipment should be ready for this kind of phenomenon and companies should be aware that surface ESD could happen at their production line. Though there are current ESD controls and knowledge of the classical ESD models, these may not be sufficient enough to comprehend the new ESD failure model. An increasing trend in customer complaint due to IN/INS shorting triggered the team to come-up with corrective/preventive action to eliminate this problem. Employing Philips\´ MEDIC approach and use of statistical engineering tool we were able to define an action to prevent occurrence of such phenomenon. The team achieved a reduction in DC fails, zero customer complaints and a priceless benefit... "customer delight".
Keywords :
electrostatic discharge; integrated circuit packaging; IN/INS shorting; statistical engineering tool; surface ESD; Collaboration; Electrostatic discharge; Manufacturing industries; Manufacturing processes; Passivation; Production; Semiconductor device manufacture; Semiconductor devices; Surface cracks; Surface discharges;
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
DOI :
10.1109/EPTC.2006.342796